Owing to the benefits such as exceptional heat absorption feature along with the reduction in the size of the flip chips compared with the traditional chip packaging is increasing the favorability of flip chips in the consumer electronic industry, thus creating an overall boost in the demand for Flip chip technology in the market over the estimated period.
COVID- 19 Impact & Market Status
The pandemic significantly impedes commercial expansion. Due to COVID-19, the market of electronic products has seen a negative impact because of the lockdown and non – availability of raw materials, components, and finished goods. This finally caused the market for flip chip technology to grow slowly. Additionally, the pandemic majorly influenced the supplier by causing a sudden disruption in the supply chain and shutdown due to COVID restrictions. In keeping pace with the sudden changes, the semiconductor sector is forced to change its supply chain model which consequently brings a positive impact on the demand of the market.
Asia Pacific Region to Dominate the Market
Asia Pacific is thought to lead the market by making the largest contribution to the flip-chip technology sector. Asia Pacific region concludes nations such as India, China, and Japan among the other countries, which are the largest manufacturers and consumers of personal electronic devices. This is possible because the leading corporates such as Samsung and TSMC Ltd. employ their significant amount of funds in carrying out comprehensive research & development activities which in return help in growing the flip chip market in the local as well international market. The study observes no change in the dominance in the market by holding largest share in generating revenue in the upcoming 10 years. China is holding a significant market share. Moreover, continuous innovation and increasing inclination towards multi-purpose devices in various segments lead to the growth of the flip-chip technology market in the Asia Pacific Region.
The need for better performance of electronic devices and further adoption of multi-purpose devices in various different industries such as military & aerospace, telecommunication, and automotive is constantly propelling the growth of the global flip chip technology market.
Additionally, the advancement in the gaming industry and increased users of the same industry, simultaneously benefit the flip-chip technology industry. This observation is made because flip chips are installed in the sensors that are fitted into smartphones, which gives the consumer the real-life experience while indulging in playing games since as per the direction of the device the visuals are also changing.
Due to the presence of bumps that formed connections, which is responsible for enhanced electrical efficiency and reduction in the length and thus due to which flip chip technology is able to provide data transmission amid devices on a higher frequency. As the demand for ultrasonic frequency operations, high-frequency microwave, and high-frequency electronic devices is increasing, the demand for flip-chip technology is also accelerated, resulting in the development of flip-chip market technology in the forthcoming years.
The further contribution of significant manufacturers in research and development activities for the growth of flip-chip is also responsible for increasing the adoption of these devices in the market. It provides the benefits of higher signal density and with the usage of the same amount of I/0, the relative size of the die can visibly shrink which added to the list of advantages these flip chips can come up with. These factors collectively incite the growth in the global flip chip technology market, securing the overall market size of $41.24 million at a CAGR of 6.23% in the forecasting period of 2022 to 2029.
Advancement in electronic packaging with a view to providing multi-purpose solutions and an increase in the dependability of circuits is the major driver which caused the expansion of the flip chip technology market in the forecasting period. However, reasons such as the extremely complex size and structure of these chips failed to provide the flexibility of customization after production which can be seen as a restraining aspect in the growth prospect of the flip chip technology market. With the constant contribution to R&D activities by larger manufacturers can help overcome these restraints and help in the development of the market.
In line with this, the study demonstrates the effective strategies that are adopted by a major player in the flip chip technology market are 3M, Intel Corporation, ABM, Samsung Electronics co. Ltd. Taiwan Semiconductor, Texas Instruments Incorporated, Amkor Technology, and Apple Inc., Fujitsu Limited and Advanced Micro Devices, Inc. Furthermore, the report also outlines the upcoming opportunities to grab by the market participants, negative changes prevailing in the market, scope, and the abrupt changes in the market caused by changes in trends. The reports also suggest some of the operational policies adopted by the leading corporates
Latest Innovations in the Global Flip Chip Technological Market: A Snapshot
In September 2022, Bharti Airtel, one of India's largest telecom service providers with more than 358 million subscribers, and IBM (NYSE: IBM) disclosed their intention to collaborate on the development of Airtel's edge computing platform in India, which will have 120 network data centres spread across 20 cities. The platform's goal is to speed up creative solutions that provide new value to operations and clients for large enterprises across a variety of industries, including manufacturing and the automotive sector, safely at the edge.
In September 2022 IBM unveiled the most recent version of its LinuxONE server, a highly scalable Linux and Kubernetes-based platform, in order to support thousands of workloads inside the footprint of a single system1. Features in IBM LinuxONE Emperor 4 can help clients use less energy. For instance, running Linux workloads on five IBM LinuxONE Emperor 4 systems rather than running them on equivalent x86 servers under the same conditions can save energy usage by 75%, free up 50% more space, and reduce the carbon impact by around 850 metric tonnes yearly.
Flip Chip Technology Market Scope
|Forecast Unit||Value (USD)|
|Revenue forecast in 2029||$ 41.24 million|
|Growth Rate||CAGR of 6.23% during 2021-2029|
|Segment Covered||Product, Industrial Application, Packaging, Packaging Technology, Bumping Technology, Regions|
|Regions Covered||North America, Europe, Asia Pacific, South America, Middle East and Africa|
|Key Players Profiled||3M, Intel Corporation, ABM, Samsung Electronics co. Ltd. Taiwan Semiconductor, Texas Instruments Incorporated, Amkor Technology, and Apple Inc., Fujitsu Limited and Advanced Micro Devices, Inc. Furthermore|
Key Segment of The Global Flip Chip Technology Market
Product overview, 2019- 2029 [ USD Million]
• Image Sensor
Industrial Application overview, 2019- 2029 [ USD Million]
• Electronic Industry
• Automotive and Transport
• Medical Sector
• Industrial Sector
• Military& Aerospace
• Smart Technologies
Packaging overview, 2019- 2029 [ USD Million]
• FC PGA
• FC LGA
• FC BGA
• FC QFN
• FC SiP
Packaging Technology overview, 2019- 2029 [ USD Million]
• 2D IC
• 2.5D IC
• 3D IC
Bumping Technology overview, 2019- 2029 [ USD Million]
• Copper Pillar
• Gold Bumping
• Solder Bumping
Region overview, 2019- 2029 [ USD Million]
• Rest of Europe
• Rest of Asia Pacifuc
• Rest of south America
The Middle East and South Africa