The approach of connecting a semiconductor die to a substrate or packaging is referred to as die bonding
At a compound annual growth rate of 3.4%, the size of the worldwide Die Attach Materials market is projected to reach $865 Million in 2027.
Covid-19 Impact & Market Status
The pre- and post-COVID effect on market growth and development is vividly depicted in this report for a better understanding of the Die Attach Materials Market based on financial and industrial data. The COVID epidemic has had a substantial influence on the market for Die Attach Materials. The COVID outbreak has had a significant impact on the Die Attach Materials Market.
It's commonly used to link a chip or IC to packaging, but it can also be used to connect a die to a PCB or other components. It is a popular connection technique due to its low cost and versatility. The COVID 19 outbreak has impeded the growth of the die attach machine business due to the nations' lockdown measures and delays in manufacturing and manufacture of die attach machines.
The novel coronavirus has spread fast throughout various nations and regions, wreaking havoc on people's lives and the community as a whole. It began as a human fitness concern and has now evolved into the most serious threat to international trade, economics, and finance. The impact of the COVID-19 lockout is unknown, and the economic recovery of die-attach machine companies is totally contingent on their financial reserves.
After coronavirus cases began to decline, die-attach machine manufacturers had to focus on protecting their employees, operations, and supply chain partners to effectively respond to the present crisis and create new methods of working. Furthermore, with the advent of a COVID-19 vaccine on the market, the quantity of COVID-19 instances is anticipated to say no withinside the close to future.
This is also expected to result in the resumption of full-capacity die-attach machine firms, aiding the market's recovery by the beginning of 2022. Furthermore, the market is expected to develop due to global growth in the semiconductor equipment industry and an increase in demand for LED chips over the forecast period.
According to Type
The market segments include Die Attach Paste, Die Attach Wire, and Others. Die Attach Paste presently has the biggest market share and is expected to grow considerably and continue to dominate the worldwide market throughout the projected period.
According to the Application
The market is divided into areas such as consumer electronics, automotive, medical, telecommunications, and others. The Consumer Electronics component has the largest market share in the worldwide market and is predicted to grow rapidly throughout the forecast period. Consumer Electronics has the most market share within the global enterprise and is expected to grow at a rapid pace over the forecast period.
North America and Europe presently preserve the most important marketplace percentage
The global die-connect substances market is divided into four regions: North America, Asia Pacific, Europe, and the Rest of the World. North America and Europe presently have the biggest market share and are likely to expand and dominate the Global Die Attach Materials Market throughout the forecast period.
Die attach materials are the materials used to connect components to dies
From 2022 to 2029, the global die-attach machine market is expected to grow at a CAGR of 6.1 percent, from $1,129.0 million in 2022 to $1,921.1 million in 2029. Die-attach materials perform two key functions: heat intemperance in the die and mechanical fixing of the die on the substrate.
Because of the high heat density, eutectic solder alloys and traditional die-attach adhesives are not suitable as die-attach materials in high-power and power applications. As a result, for these types of applications, high-melting solder alloys are employed, which contain more than 50% copper.
Die-attach, also known as die bonding, is a method of attaching a semiconductor die to a substrate (such as a PCB board), a package, or another die, and die-attach materials are the materials used in this process. Various types of packing rely on this procedure.
Because of increased consumer electronics demand, the worldwide market for electrical circuit boards is likely to grow. Furthermore, the increasing use of various electronic components, including die attach materials, is fueling the use of various electronic components in numerous sectors throughout the world.
Die-attach materials demand is expected to rise as the need for adhesive in diverse applications grows, as does the use of die-attach films in packaging, rising disposable income levels, and worldwide urbanization. The increased use of die attach materials in LED assemblies is also projected to benefit the market.
Because of the requirement to establish the reliability and performance characteristics of LEDs, die-attach materials are expected to be in high demand. However, there are hurdles in the market for die-attach materials, such as the necessity to remove gaps in die-attach joints, as voids can have negative impacts on electrical performance, hampering a device's overall performance.
Companies in the market are employing X-ray detection technologies to solve this problem and improve the dependability of die attach materials. Die-attach, also known as die bonding, is a method of attaching a semiconductor die to a substrate (such as a PCB board), a package, or another die, and die-attach materials are the materials used in this process. Various types of packing rely on this procedure.
Some of the major players in the Global Die Attach Materials Market research report include SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore, Heraeu, AIM, TAMURA RADIO, Kyocera, Shanghai Jinji, Palomar Technologies, Nordson EFD, and Dow Corning Corporation.
A Snapshot of the Most Recent Innovations in the Global Die Attach Materials Market
- Electroninks established a strategic partnership with Enjet Inc. in March 2020 to assist advanced manufacturing of display, touchpanel, and packaging solutions.
- In July 2021, DuPont introduced an advanced display screen that revealed a sinter silver answer for strength semiconductor die-connect that improves productiveness and reliability withinside the strength module meeting process.
- Because of technological improvements, strong demand from the end-user sector, and adhesive film with die attach double functionality, the overall market is predicted to grow.
- Significant advancements in die attach films with high dependability for advanced packages such as BGA/CSP have made them a preferred choice for a variety of end-user sectors.
- On the other hand, one of the primary issues limiting the growth of the die attaches materials market is their functional attribute of mechanical fixation, which limits their use in the market.
Die Attach Materials Market Scope
|Forecast Unit||Value (USD)|
|Revenue forecast in 2028||USD 1,921.1 million|
|Growth Rate||CAGR of 6.1 % during 2021-2028|
|Segment Covered||By Type, By Application, Regions|
|Regions Covered||North America, Europe, Asia Pacific, Rest of the World|
|Key Players Profiled||SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore, Heraeu, AIM, TAMURA RADIO, Kyocera, Shanghai Jinji, Palomar Technologies, Nordson EFD & among others.|
Key Segments of the Global Die Attach Materials Market
• Die-Attach Paste
• Die-Attach Wire
• Consumer Electronics
- North America
- Asia Pacific
- Rest of the World