Thermally conductive adhesives market By Morphology (Isotropic Conductive Adhesives, Anisotropic Conductive Adhesives), By Filler Material (Silver Fillers, Copper Fillers, Carbon Fillers, Others), By Application (Automotive, Consumer Electronics, Biosciences, Aerospace, Others), By Chemistry (Epoxy Based, Silicon-Based, Polyurethane Based, Acrylic Based, Others), and Region Global Forecast 2020 to 2030.

The global thermally conductive adhesives market is anticipated to increase at a 8.88% CAGR to reach value USD 4808.96 Million  in 2030

Thermally conductive adhesives are often used to dissipate heat from power electronics. It has extreme insulating properties and helps in forming a mechanical attachment of a component with a heat sink along with thermal transfer features and without any extra fasteners requirement. The thermally conductive adhesives easily mixes well with most plastics, metals, glasses, and ceramics that are used in electronic assemblies. Since these adhesives are highly filled with thermal conductive ceramic powders, it is viscous in nature. This conductive ceramic powders helps to provide maximum thermal conductivity for electronic appliances. These adhesives are designed mostly to offer an efficient heat transfer path between heat generating components, heat sinkers or other cooling devices.

Thermally conductive adhesives that are infused with inorganic or metallic filler materials are termed as synthetic resins. The best thermal conduction factors can be accomplished with metallic fillers namely graphite or silver. Though, due to this, the adhesive becomes electrically conductive, which is sometimes unwanted in various applications. Adhesives improved with ceramic or mineral-based fillers must be used to attain electrical insulation and thermal conductivity at the similar time.

Thermally conductive adhesives have the benefit of holding or mounting components while dispersing thermal energy, in comparison to heat transfer compounds. These adhesives are also used in temperature sensors for reactors or enclosures as encapsulation compound.

Adhesives with thermal conductivity, when used as a joining technique, helps to attach components to form a durable mechanical connection, despite allowing the heat to transfer to the colder component from the warmer component. Hence, thermally conductive bonding acts as a substitute to conventional connection methods such as welding, soldering, or screwing in many situation

Epoxies based adhesives are anticipated to augment thermally conductive adhesives market growth

Based on the product type, epoxy-based adhesives segment is expected to witness substantial demand in the near future owing to its numerous advantages. Thermally conductive epoxy-based adhesives need less processing time and requires little handling of assemblies, which as a result, delivers quicker production. Thermally conductive epoxy adhesives demonstrate good gap filling in electronic appliances, low viscosity for potting applications, great adhesive strength, and descent surface wet out. These epoxy adhesives are mostly used in for encapsulation, potting, and bonding applications in a varied industries. Few particular applications include heat sinking potting, bonding, and encapsulating sensors, etc.

Thermally conductive silicone adhesives offers solutions for most of the sensitive circuits and its components. The silicone-based thermally adhesives assure that the components remain functional even when the appliances become hot. Furthermore, these adhesives help in transferring the device’s heat to the heat sink. Polyurethane-based thermally conductive adhesives are used for advanced electronic assembly. These type of adhesives are particularly suitable for electronic bonding and potting which has self-levelling and injectable compound.

Asia Pacific will lead the growth in this market

The Asia Pacific is a prominently large market for thermally conductive adhesives due to the existence of vast number of electronics companies in countries such as Taiwan, China, Japan, and South Korea. The thermally conductive adhesive companies in Asia Pacific are investing more in research and development, which have led to high demand novel products in the market, facilitated by robust end-user industry.

The thermally conductive adhesives market in North America is estimated to expand considerably in the near future, led by the increasing demand for these conductive adhesives in the automotive and electronics industries. North America is regarded as one of the major markets for thermal conductive adhesives market, led by the improvement in the growth of electronics industry.

Key Market Players

• 3M Co.
• Dow Corning Corporation
• Lord Corporation
• Permabobd Llc.
• Polytec PT GmbH
• Master Bond Inc.
• Creative Materials Incorporated
• Protavic America Inc.
• Aremco Products Inc.
• Wacker Chemie AG
• SEPA EUROPE GmbH
• Panacol-Elosol GmbH
• Mitsui Chemcials, Inc.
• BASF SE
• LG Chemcial Limited
• Kyocera Chemcial Corporation
• Permabond
• H.B. Fuller
• MG Chemicals

thermally conductive adhesives market Scope

Key Segment Of The thermally conductive adhesives market

by Morphology (USD Million)            
    •    Isotropic Conductive Adhesives
    •    Anisotropic Conductive Adhesives
by Filler Material (USD Million)
    •    Silver Fillers
    •    Copper Fillers
    •    Carbon Fillers
    •    Others
by Application (USD Million)
    •    Automotive
    •    Consumer Electronics
    •    Biosciences
    •    Aerospace
    •    Others
by Chemistry (USD Million)
    •    Epoxy Based
    •    Silicon-Based
    •    Polyurethane Based
    •    Acrylic Based
    •    Others
Regional Overview (USD Million)
    North America
      •    US
      •    Canada
    Europe
      •    Germany
      •    France
      •    UK
      •    Rest of Europe
    Asia Pacific
      •    China
      •    India
      •    Japan
      •    Rest of Asia Pacific
    South America
      •    Mexico
      •    Brazil
      •    Rest of South America
    Middle East and South Africa