Solder preforms are a metal-based product that is used for packing components in leaded and lead-free soldering. They are metal tubes of various shapes and sizes, with the end cut off so that they can be filled with solder paste. As the demand for electronics continues to rise, the usage of solder preforms has also increased, providing a stable market for this product.
Drivers of the Solder Preform Market
The drivers of the Solder Preform Market are strong growth in the electronics & semiconductor industry, rapid invention and globalization of new technologies, surge in demand for miniaturized and smart products, growing adoption of automotive electronics.
Rising trends for miniature electronics and decreasing size of semiconductor chips is going to drive the growth of the Solder Preform Market over the forecast period. Strong growth in the electronics & semiconductor industry and rapid invention and globalization of new technologies are some of major factors propelling the market growth. Moreover, surge in demand for miniaturized and smart products as well as strong inclination towards lead-free solders is expected to fuel up this market over the forecast period. Furthermore, increasing use of eutectic solders due to zero wetting properties with high reliability on delicate electronic applications is projected to bode well with further expansion opportunities in solder preform market. Additionally, rising trend for portable electronic devices such as mobile phones, tablets and iPods has increased the demand for flexible printed circuit boards (PCB) which will create new revenue generation pockets across different regions worldwide during forecast timeline. Moreover, increasing application base including military & defines engineering processes where solder preforms are used for shock vibration resistance product designs is likely to offer further business expansion opportunities over foreseeable future
Advantages of the Solder Preform Market
1. The material is simple, the components are easy to be manufactured and processed, so the process cost is low.
2. Since the solder preform has a complex shape, it can be used for surface mounting on electronic components with complex shapes or difficult assembly. When soldering two surfaces that cannot be directly connected together due to the unevenness of the surface, you can use a solder preform as a Solder Paste Manufacturer to connect them.
3. It improves reliability because when using solder preforms for soldering, it is possible to reduce the stress caused by heat during soldering and mechanical vibration during assembly or operation of electronic devices. Therefore, this method can be used for critical sections of mobile phones and computers where reliability is required.
4. Since the waste heat generated during welding can be transmitted efficiently between parts that require cooling after soldering, they are often used in high-power circuits such as power amplifiers and microwave circuits where heating is significant.
Market Value and CAGR of the Solder Preform Market (2021-2032)
The market value and CAGR is expected to increase from US$ 1230.4 Mn in 2021 to US$ 3770.3 Mn by 2032 with a compound annual growth rate of 14.2%. The study period is from 2021–2032.
Challenges of the Solder Preform Market
The challenges of the Solder Preform Market are:
High cost of Solder Preforms which is a concern along with Complications associated with Solder Preforms which decreases its application. However, the market is only expected to rise in the future.
Key Players in the Solder Preform Market
Some of the key players in the Solder Preform Market are AIM Solder, Nihon Superior Co. Ltd., Henkel AG & Co. Kagan, Alpha Assembly Solutions Inc., and Attach Deutschland GmbH among others.
Segment Analysis into type, application, end users and region in Solder Preform Market
The most demanded product of the Solder Preform Market is Lead-free tin-silver-copper alloy (SAC305). This product is widely used for advanced packaging and microelectronics in the industry.
By application, Solder Preform is widely used in the field of electronics. The electronics industry is associated with consumers and commercial electronics, which are growing rapidly and are likely to grow during the forecast period. The service sector, which includes data centres and cloud services, health care, automotive, defines and aerospace applications, is expected to fuel demand for solder preforms during the forecast period.
Europe currently dominates the global market for solders due to continuous technological advancement in this region. The presence of a large number of original equipment manufacturers (OEMs) presents opportunities for local suppliers to serve the growing customer base. In addition to lead-free solders such as tin-silver-copper alloys that can be used in advanced packaging applications including flip chips due to their higher reliability and thermal conductivity properties than lead-based alloys, European researchers are also working on alternative lead-free materials that can be used for advanced packaging applications.
Impact of Covid-19 on Solder Preform Market
The COVID-19 pandemic has had a significant impact on the solder preform market. The outbreak of the pandemic has led to a decrease in demand for solder preforms from the military and aerospace, medical, semiconductor, and electronics industries. This has resulted in a decline in revenue for companies operating in the solder preform market.
The military and aerospace industry are one of the major consumers of solder preforms. The outbreak of the COVID-19 pandemic has led to a decrease in demand for solder preforms from this industry. This is due to the cancellation or postponement of various military programs and projects worldwide. For instance, the United States Department of Défense has cancelled or postponed several major programs, including the Joint Strike Fighter program, due to budget cuts caused by the pandemic. This has had a negative impact on companies supplying solder preforms to this sector.
Similarly, there has been a reduction in demand for solder preforms from the medical industry due to the outbreak of COVID-19. Hospitals and other medical facilities have postponed or cancelled elective surgeries and procedures due to the pandemic. This has led to a decline in revenue for companies supplying solder preforms to this industry.
The semiconductor industry is another major consumer of solder preforms. The outbreak of COVID-19 has led to a decrease in demand for semiconductor products globally. This is due to the shutdown of factories and assembly plants in various countries worldwide. Moreover
Key developments in the Solder Preform Market 2018-2022
In January, 2019, Kester announced the launch of its new soldering paste. The new product is low-halogen and lead-free soldering paste with a no-clean formulation. This launch will help the company expand its presence in the global Solder Preform market.
In January, 2019, Henkel launched LOCTITE GC 10. It is a high-activity flux for tin-lead applications in reflow and wave solder assembly processes. The LOCTITE GC 10 provides high activities for cleanability on highly oxidized lead surfaces and deep within surface voids to ensure reliable wetting and increased assembly yields.
Solder Preform Market Scope
|Forecast Unit||Value (USD)|
|Revenue forecast in 2030||US$ 3770.3 Million|
|Growth Rate||CAGR of 14.2 % during 2021-2030|
|Segment Covered||Type, Application, Regions|
|Regions Covered||North America, Europe, Asia Pacific, South America, Middle East and Africa|
|Key Players Profiled||AIM Solder, Nihon Superior Co. Ltd., Henkel AG & Co. Kagan, Alpha Assembly Solutions Inc., and Attach Deutschland GmbH among others.|
Key Segments of the Solder Preform Market
Type Overview, 2021-2031 (USD Billion)
• Lead Free
Application Overview, 2021-2031 (USD Billion)
• Military and Aerospace
Regional Overview, 2021-2031 (USD Billion)
• Rest of Europe
• Rest of Asia Pacific
• Rest of South America
• Middle East and South Africa