The expanding trend of 3DIC technology, the increasing deployment of semiconductor packaging in the automotive electronics and consumer electronics sectors, and the rising need for miniaturisation and improved performance from electronic devices are the key growth factors for this industry. This market is expanding as a result of the rise in Internet of Things (IoT) devices, the requirement for faster data rates, and the desire for more energy-efficient devices.
The market for IC advanced packaging equipment is expanding as more semiconductors and other electronic products are being sold. Devices are now more portable and smaller thanks to technological innovation. The demand for semiconductor chips and other related equipment has surged as a result.
IC advanced packaging technology offers a number of advantages, including increased productivity, enhanced reliability, and higher yields. Additionally, it helps to lower production costs and raise product quality. It supports numerous languages and provides a vast array of customization possibilities.
For semiconductor devices, advanced packaging is an assembly and packaging technique. More functionality and greater performance are made possible in smaller packages because to this. Multi-die integration into a single package is accomplished using this technique. System-in-package (SiP), chip scale package (CSP), ball grid array (BGA), flip chip BGA (FCBGA), plastic leaded chip carrier (PLCC), plastic quad flatpack (PQFP), thin small outline package (TSOP), and others are some of the main varieties of advanced packaging.
At a CAGR of 9.4%, the market for IC advanced packaging equipment is anticipated to increase from USD 4.8 billion in 2020 to USD 10.9 billion by 2031.
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The demand for smaller, high-performance electronic devices is on the rise, and semiconductor companies are investing more in R&D, which is fuelling the market for IC advanced packaging equipment.
Some of the biggest obstacles this business must overcome include the high cost of sophisticated packaging technologies and the shortage of competent labour. Another obstacle limiting the expansion of this sector is the volatility of raw material costs. However, it is anticipated that the rising use of innovative packaging technologies in developing nations would open up fresh prospects for market expansion.
COVID-19 Impact and Market Status
The COVID-19 pandemic has severely damaged the world economy, forcing companies from all industries to halt operations in order to slow the virus' spread. With manufacturing stalled in a number of nations, the semiconductor and electronics industry are not an exception. The IC advanced packaging equipment industry now faces problems on top of those brought on by lowering average selling prices and ened competition. But in 2021, the market is anticipated to bounce back and resume its pre-pandemic growth trajectory, propelled by a surge in demand for 5G smartphones and other cutting-edge analytics.
Segment Analysis
Solid Crystal Devices have Highest Market Size
The market for IC Advanced Packaging Equipment is made up of the categories of cutting equipment, solid crystal devices, welding equipment, testing equipment, and others. The category for solid crystal devices is estimated to grow at the highest CAGR during the forecast period. The growing need for smaller, more powerful intelligent electronic devices is one of the major drivers of this market's rise.
Automotive Application to Expand the Market Further
Because semiconductor packaging is being used in more automotive applications, the automotive electronics market is anticipated to rise at a faster CAGR throughout the forecast period. This industry is expanding as a result of rising demand for electric vehicles motor as well as the requirement for electronic devices to be smaller and perform better.
Asia-Pacific Region is Hishest Market Throughout the Forecasted Period
The North American, European, Asia Pacific, South American, African, and Middle Eastern regions make up the major segments of the global market for IC advanced packaging equipment. Asia Pacific is anticipated to have the highest market over the projection period of all of these regions. The rapid growth of this region can be ascribed to expanding consumer electronics demand as well as growing investments in fabless IC design activities and semiconductor manufacturing in nations like China and Taiwan.
Applied Materials, Inc., Tokyo Electron Limited, Jusung Engineering Co., Ltd., Lam Research Corporation, Teradyne, Inc., KLA Corporation, Süss MicroTec SE, and NuFlare Technology, Inc. are some of the major companies covered in this market.
Latest Innovations in the Global IC Advanced Packaging Equipment Market: A Snapshot
• In October 2020, Extreme ultraviolet (EUV) inspection tools manufacturer Hermes Microvision, Inc. was acquired by ASM International N.V.. ASM International N.V. is a top supplier of semiconductor packaging and assembly solutions. The acquisition will assist ASM in diversifying its product offering and enhancing its market position for EUV lithography.
• In September 2020 , Onto Innovation Inc., a provider of metrology and inspection solutions for the semiconductor industry, said that Jusung Engineering Co., Ltd., a leading supplier of semiconductor equipment, has acquired an additional 10% share in the company. Jusung will be able to broaden its product offering and solidify its market position thanks to the acquisition.
• In September 2020, Advantest Corporation, a well-known supplier of semiconductor testing tools, declared that it had purchased all of the stock in Verigy Pte. Ltd., a supplier of semiconductor testing solutions. Advantest will be able to broaden its product offering and solidify its market position thanks to the acquisition.
Fully Automatic UV-Curing Equipment Market Scope
| Metrics | Details |
| Base Year | 2023 |
| Historic Data | 2018-2022 |
| Forecast Period | 2024-2031 |
| Study Period | 2018-2031 |
| Forecast Unit | Value (USD) |
| Revenue forecast in 2031 | USD 10.9 billion |
| Growth Rate | CAGR of 9.4 % during 2021-2031 |
| Segment Covered | by Type, By Application, Regions |
| Regions Covered | North America, Europe, Asia Pacific, South America, Middle East and Africa |
| Key Players Profiled | Applied Materials, Inc., Tokyo Electron Limited, Jusung Engineering Co., Ltd., Lam Research Corporation, Teradyne, Inc., KLA Corporation, Süss MicroTec SE, and NuFlare Technology, Inc. |
Key Segments of the Global IC Advanced Packaging Equipment Market
Type Overview, (USD Billion)
- Cutting Equipment
- Solid Crystal Devices
- Welding Equipment
- Testing Equipment
- Other
Application Overview, (USD Billion)
- Automotive Electronics
- Consumer Electronics
- Other
Regional Overview (USD Billion)
North America
- U.S
- Canada
Europe
- Germany
- France
- UK
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- Rest of Asia Pacific
South America
- Mexico
- Brazil
- Rest of South America
Middle East and South Africa
- UAE
- South Africa
Frequently Asked Questions (FAQ) :
The global IC Advanced Packaging Equipment market size is expected to reach USD 10.9 billion in 2031.
The IC Advanced Packaging Equipment market is estimated to grow at a CAGR of 9.4 % during 2021-2031
Key companies covered in the IC Advanced Packaging Equipment market are Applied Materials, Inc., Tokyo Electron Limited, Jusung Engineering Co., Ltd., Lam Research Corporation, Teradyne, Inc., KLA Corporation, Süss MicroTec SE, and NuFlare Technology, Inc.